US 12,238,899 B2
Thermal management of high heat flux multicomponent assembly
Radesh Jewram, Lakeville, MN (US); and Yuan Zhao, Tustin, CA (US)
Assigned to Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed by Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed on Jan. 24, 2022, as Appl. No. 17/582,275.
Application 17/582,275 is a continuation of application No. PCT/US2020/043116, filed on Jul. 22, 2020.
Claims priority of provisional application 62/877,495, filed on Jul. 23, 2019.
Prior Publication US 2022/0151108 A1, May 12, 2022
Int. Cl. H02H 5/00 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/20509 (2013.01) 20 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a substrate;
an electronic component array including a plurality of discrete spaced-apart electronic components secured to said substrate;
a heat dissipater; and
a thermal interface positioned in a thermal pathway between said electronic component array and said heat dissipater, said thermal interface including a heat spreading layer and a compliant layer, and a thickness defined along a thickness axis through said heat spreading layer and said compliant layer, wherein said heat spreading layer is less than 20% of the thickness and exhibits a first thermal conductivity, and said compliant layer exhibits a second thermal conductivity that is substantially less than the first thermal conductivity and a compressive modulus of between 104 Pa-106 Pa.