US 12,238,897 B2
Heat dissipation structure, method for manufacturing heat dissipation structure, and electronic apparatus
Ryota Watanabe, Kanagawa (JP); Masahiro Kitamura, Kanagawa (JP); Mizuki Itoyama, Kanagawa (JP); Takuroh Kamimura, Kanagawa (JP); and Junrong Zhou, Beijing (CN)
Assigned to Lenovo (Singapore) Pte. Ltd., Singapore (SG)
Filed by Lenovo (Singapore) Pte. Ltd., Singapore (SG)
Filed on Dec. 12, 2022, as Appl. No. 18/079,375.
Claims priority of application No. 2022-001927 (JP), filed on Jan. 7, 2022.
Prior Publication US 2023/0240047 A1, Jul. 27, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/2039 (2013.01) [G06F 1/206 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A heat dissipation structure for a heat-generating electric component, comprising:
a heat dissipator disposed along a surface of the electric component; and
a porous material held between the electric component and the heat dissipator, wherein
the porous material being impregnated with heat-transfer fluid, and
the porous material includes a metal material, and includes nickel at least on the surface.