| CPC H05K 7/20381 (2013.01) [H05K 7/203 (2013.01); H05K 7/20318 (2013.01); H05K 7/20336 (2013.01)] | 20 Claims |

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1. An apparatus for two-phase liquid immersion cooling, comprising:
a first enclosure that is configured to contain a dielectric liquid having a boiling point, a vapor layer above the dielectric liquid layer, and an air layer above the vapor layer, such that a vapor-air boundary is disposed between the vapor layer and the air layer;
a condenser that is configured to condense vapor in the vapor layer; and
a first strip within the first enclosure that is disposed above the dielectric liquid, wherein the first strip is composed of a thermo-conductive material, wherein the apparatus is configured to cool a portion of the first strip to a temperature below the boiling point of the dielectric liquid layer, and wherein the apparatus is further configured to determine a location of the vapor-air boundary based on a detected temperature along a length of the first strip.
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