US 12,238,892 B2
Immersion cooling for integrated circuit devices
Raanan Sover, Haifa (IL); James Williams, Portland, OR (US); Bradley Smith, Vancouver, WA (US); Nir Peled, Chandler, AZ (US); Paul George, Chandler, AZ (US); Jason Armstrong, Phoenix, AZ (US); Alexey Chinkov, Haifa (IL); Meir Cohen, Chandler, AZ (US); Je-Young Chang, Tempe, AZ (US); Kuang Liu, Queen Creek, AZ (US); Ravindranath Mahajan, Chandler, AZ (US); Kelly Lofgreen, Phoenix, AZ (US); Kyle Arrington, Gilbert, AZ (US); Michael Crocker, Portland, OR (US); and Sergio Antonio Chan Arguedas, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 21, 2020, as Appl. No. 17/128,620.
Prior Publication US 2022/0201889 A1, Jun. 23, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/203 (2013.01) [H05K 7/20309 (2013.01); H05K 7/20318 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
an integrated circuit device electrically attached to a first surface of an electronic substrate;
a support device electrically attached to the first surface of the electronic substrate, wherein the support device is electrically attached to the integrated circuit device; and
a conformal boiling enhancement coating covering the support device and a portion of the first surface of the electronic substrate, the boiling enhancement coating to be in direct contact with a liquid in which both the integrated circuit device and the support device are to be immersed.