US 12,238,887 B2
Mounting apparatus for components without mounting points in modular data centers
Tyler Baxter Duncan, Austin, TX (US); and Anthony Middleton, Cedar Park, TX (US)
Assigned to DELL PRODUCTS L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on Oct. 20, 2022, as Appl. No. 17/970,310.
Prior Publication US 2024/0138090 A1, Apr. 25, 2024
Prior Publication US 2024/0237257 A9, Jul. 11, 2024
Int. Cl. H05K 7/14 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/1489 (2013.01) [H05K 7/1405 (2013.01); H05K 7/1487 (2013.01); H05K 7/20145 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A modular information technology component (MITC), comprising:
a component;
a floor, wherein the floor comprises a first section, a second section, a third section, a floor track apparatus (FTA), and a second FTA,
wherein the FTA is located on a first side of the floor and extends along the first side,
wherein the second FTA is located on a second side of the floor and extends along the second side,
wherein the first side and the second side are parallel to each other
wherein the FTA and the second FTA are rails,
wherein the second section is elevated relative to the first section and the third section,
wherein an information handling system (IHS) and a cooling distribution unit are located on the second section, wherein the FTA is integrated into the first section and the second FTA is integrated into the third section; and
a bottom mounting component (BMC),
wherein the BMC affixes the component to the FTA.