US 12,238,872 B2
Circuit board with bridge chiplets
Robert N. McLellan, Austin, TX (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Feb. 8, 2022, as Appl. No. 17/667,467.
Application 17/667,467 is a division of application No. 15/287,255, filed on Oct. 6, 2016, granted, now 11,277,922.
Prior Publication US 2022/0167506 A1, May 26, 2022
Int. Cl. H05K 3/36 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H05K 1/03 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01)
CPC H05K 3/368 (2013.01) [H01L 21/4807 (2013.01); H01L 21/485 (2013.01); H01L 21/52 (2013.01); H01L 23/5383 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H05K 1/142 (2013.01); H05K 1/186 (2013.01); H01L 23/5385 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H05K 1/0306 (2013.01); H05K 1/0313 (2013.01); H05K 1/181 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/10378 (2013.01)] 19 Claims
OG exemplary drawing
 
9. A method of manufacturing, comprising:
fabricating a chiplet to insert into a pocket of a circuit board, the chiplet having plural bottom side interconnects to electrically connect to a conductor layer of the circuit board and plural top side interconnects adapted to interconnect with two or more semiconductor chips, wherein the circuit board comprises plural build-up layers, the pocket extending vertically into at least two of the build-up layers and including a portion of the conductor layer exposed during fabricating of the pocket into the at least two build-up layers.