US 12,238,871 B2
Method for manufacturing component embedded circuit board
Yong-Chao Wei, Qinhuangdao (CN); and Yong-Quan Yang, Qinhuangdao (CN)
Assigned to QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an (CN); and Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN)
Filed by QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an (CN); and Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN)
Filed on Oct. 8, 2021, as Appl. No. 17/497,809.
Application 17/497,809 is a division of application No. 16/550,601, filed on Aug. 26, 2019, granted, now 11,178,777.
Claims priority of application No. 201910562603.3 (CN), filed on Jun. 26, 2019.
Prior Publication US 2022/0030720 A1, Jan. 27, 2022
Int. Cl. H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/32 (2006.01); H05K 13/04 (2006.01)
CPC H05K 3/325 (2013.01) [H05K 1/0243 (2013.01); H05K 1/165 (2013.01); H05K 1/186 (2013.01); H05K 3/103 (2013.01); H05K 3/321 (2013.01); H05K 3/4623 (2013.01); H05K 13/04 (2013.01); H05K 3/4697 (2013.01); H05K 2201/10098 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for manufacturing a component embedded circuit board, comprising:
providing a printed circuit board, wherein the printed circuit board comprises a first opening and a first circuit layer, and the first circuit layer comprises at least one first connecting pad;
mounting a component in the first opening and conductively connecting the component to the printed circuit board;
providing a dielectric layer, defining a second opening in the dielectric layer, and embedding a conductive structure in the dielectric layer; wherein the second opening penetrates the dielectric layer;
providing an antenna structure; wherein the antenna structure comprises a first ground layer; and
pressing the antenna structure, the dielectric layer, and the printed circuit board with the component in that order; wherein the component is embedded in the first opening; one end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad; the second opening corresponds to the first opening, a gap is generated by the second opening and the component.