US 12,238,866 B2
Systems and methods providing high-density memory arrangements with high-speed interconnects in a condensed form factor
Steven White, Morgantown, WV (US); and Thao An Nguyen, San Jose, CA (US)
Assigned to TORmem Inc., San Jose, CA (US)
Filed by TORmem Inc., San Jose, CA (US)
Filed on May 9, 2024, as Appl. No. 18/659,657.
Application 18/659,657 is a continuation of application No. 17/811,616, filed on Jul. 11, 2022, granted, now 11,997,792.
Prior Publication US 2024/0306305 A1, Sep. 12, 2024
Int. Cl. H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/183 (2013.01) [H05K 1/0272 (2013.01); H05K 7/20272 (2013.01); H05K 7/20772 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10416 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling unit for a rack or chassis comprising a plurality of slots in a one rack unit (1U) form factor, the cooling unit comprising:
a reservoir storing a solution;
a radiator;
a manifold comprising a plurality of ports;
tubing comprising different segments that pass the solution from the reservoir to the radiator and from the radiator to the manifold;
a pump that circulates the solution from the reservoir through said tubing; and
a case with a 1U form factor in which the reservoir, the radiator, the manifold, and the pump are housed.