US 12,238,864 B2
Electronic apparatus
Yu-Lin Hsu, Tainan (TW); Kuan-Chu Wu, Kaohsiung (TW); Ting-Yu Ke, Changhua County (TW); Min-Hsiung Liang, Hsinchu County (TW); and Yu-Ming Peng, Taichung (TW)
Assigned to Industrial Technology Research Institute, Hsinchu (TW)
Filed by Industrial Technology Research Institute, Hsinchu (TW)
Filed on Mar. 24, 2022, as Appl. No. 17/702,814.
Claims priority of application No. 110147891 (TW), filed on Dec. 21, 2021.
Prior Publication US 2023/0199961 A1, Jun. 22, 2023
Int. Cl. H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/538 (2006.01); H05K 3/00 (2006.01); H01L 23/31 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/119 (2013.01) [H01L 21/4846 (2013.01); H01L 23/13 (2013.01); H01L 23/5386 (2013.01); H05K 3/0014 (2013.01); H01L 23/3121 (2013.01); H05K 1/181 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/09118 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic apparatus, comprising:
a compression molding board, having a device bonding area and a bending area formed by compression molding, wherein the device bonding area is different from the bending area; and
a connection pad, disposed on the device bonding area of the compression molding board, wherein:
a compression molding radius of the bending area is r;
in a first direction, a first size between a molding midpoint of the bending area and an edge of the compression molding board is W;
in a second direction perpendicular to the first direction, a second size between the molding midpoint of the bending area and the edge of the compression molding board is L; and
the compression molding radius, the first size, and the second size have a following relationship: W×L/r2>19.