US 12,238,861 B2
Composite printed wiring board and method of manufacturing composite printed wiring board
Tatsuya Sakamoto, Tokyo (JP); Kenjiro Takanishi, Tokyo (JP); Hitoshi Arai, Tokyo (JP); Hiroshi Goto, Tokyo (JP); and Akihito Hirai, Tokyo (JP)
Assigned to MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)
Appl. No. 18/688,376
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Sep. 14, 2022, PCT No. PCT/JP2022/034410
§ 371(c)(1), (2) Date Mar. 1, 2024,
PCT Pub. No. WO2023/042854, PCT Pub. Date Mar. 23, 2023.
Claims priority of application No. 2021-152147 (JP), filed on Sep. 17, 2021.
Prior Publication US 2024/0334597 A1, Oct. 3, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0298 (2013.01) [H05K 1/0393 (2013.01); H05K 1/11 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 3/429 (2013.01); H05K 3/4602 (2013.01); H05K 3/4697 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A composite printed wiring board comprising:
an intermediate plate provided to surround a space;
a first printed wiring board closing one side of the space and bonded to the intermediate plate;
a second printed wiring board closing the other side of the space and bonded to the intermediate plate;
a first bonding layer bonding the first printed wiring board to the intermediate plate; and
a second bonding layer bonding the second printed wiring board to the intermediate plate; and
a through hole provided in at least any of the first printed wiring board and the second printed wiring board and
communicating with a cavity, the cavity being the space surrounded by the first printed wiring board, the second printed wiring board, the intermediate plate, the first bonding layer, and the second bonding layer, wherein
the cavity includes
a main body sandwiched between the first printed wiring board and the second printed wiring board, and
a ventilation portion connected to the main body and sandwiched between the intermediate plate and any of the first printed wiring board and the second printed wiring board, and
the through hole communicates with the main body via the ventilation portion and is provided to overlap the intermediate plate in a direction in which the first printed wiring board and the second printed wiring board sandwich the intermediate plate in between.