US 12,238,859 B2
Wiring circuit board
Shusaku Shibata, Osaka (JP); Teppei Niino, Osaka (JP); and Yosuke Nakanishi, Osaka (JP)
Assigned to NITTO DENKO CORPORATION, Osaka (JP)
Filed by NITTO DENKO CORPORATION, Osaka (JP)
Filed on Nov. 9, 2022, as Appl. No. 18/054,029.
Claims priority of application No. 2021-183756 (JP), filed on Nov. 10, 2021.
Prior Publication US 2023/0147342 A1, May 11, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/09 (2006.01); H05K 3/24 (2006.01); H05K 3/28 (2006.01)
CPC H05K 1/0296 (2013.01) [H05K 1/05 (2013.01); H05K 1/09 (2013.01); H05K 3/24 (2013.01); H05K 3/28 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A wiring circuit board comprising:
a first insulating layer;
a conductive pattern disposed on the first insulating layer, the conductive pattern having a first terminal, a second terminal, and a wire that electrically connects the first terminal and the second terminal;
a second insulating layer disposed on the first insulating layer and covering the wire without covering at least a part of the first terminal and at least a part of the second terminal; and
a protective layer disposed between the wire and the second insulating layer and protecting the wire,
wherein the protective layer consists of a metal oxide.