CPC H05K 1/0296 (2013.01) | 7 Claims |
1. A wiring circuit board comprising:
a first insulating layer consisting of resin;
a conductive pattern disposed on the first insulating layer, the conductive pattern having a first terminal, a second terminal, and a wire that electrically connects the first terminal and the second terminal;
a protective layer disposed between the first insulating layer and the conductive pattern and protecting the conductive pattern; and
a second insulating layer disposed on the first insulating layer and covering the wire without covering at least a part of the first terminal and at least a part of the second terminal,
wherein the protective layer consists of a metal oxide.
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