a first signal pad formed at a first surface mount void on a surface of the PCB, the first signal pad for connecting to a first signal contact of a differential signal high-speed data communication interface;

a second signal pad formed at a second surface mount void on the surface of the PCB, the second signal pad for connecting to a second signal contact of the differential signal high-speed data communication interface;

a guard trace formed on the surface of the PCB, the guard trace located between the first signal pad and the second signal pad;

a first ground via that couples the guard trace to a ground plane of the PCB, the first ground via located at a first end of the guard trace;

a second ground via that couples the guard trace to the ground plane of the PCB, the second ground via located at a second end of the guard trace;

a third ground via that couples the guard trace to the ground plane of the PCB, the third ground via located between the first via and the second via; and

a fourth ground via that couples the guard trace to the ground plane of the PCB, the fourth ground via located between the first via and the second via; wherein the guard trace is provided to decrease signal interference into the differential signal high-speed data communication interface;

wherein the third ground via is located at a distance (d) from the first ground via, and the fourth ground via is located at the distance (d) from the second ground via wherein the distance (d) is given as:

 where ER is a dielectric constant of an insulating layer material of the PCB, and f is an operating frequency of the differential signal high-speed data communication interface; and wherein the signal interference is decreased at an operating frequency of the differential signal high-speed data communication interface.