US 12,238,851 B2
Hardened optical platform including high-power electro-optics and heat dissipating circuitry and associated thermal solution
Chander Prakash Gupta, Gurugram (IN); Sachin Singla, Gurugram (IN); Ranjeet Chaurasiya, Gurugram (IN); Rampratap Mahawar, Gurugram (IN); and Shubham Kumar, Gurugram (IN)
Assigned to Ciena Corporation, Hanover, MD (US)
Filed by Ciena Corporation, Hanover, MD (US)
Filed on Oct. 28, 2022, as Appl. No. 17/975,721.
Claims priority of application No. 202211052459 (IN), filed on Sep. 14, 2022.
Prior Publication US 2024/0090116 A1, Mar. 14, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01); H04B 10/40 (2013.01)
CPC H05K 1/0203 (2013.01) [H05K 1/0274 (2013.01); H05K 7/202 (2013.01); H05K 7/20209 (2013.01); H05K 7/2039 (2013.01); H04B 10/40 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A hardened optical platform comprising:
a base chassis and a lid configured to seal an interior of the base chassis, wherein each of the base chassis and the lid include a first plurality of fins;
a vapor chamber, in the interior, connected to a heat exchanger;
a printed circuit board including a plurality of optical modules, and circuit components, wherein the optical modules and some of the circuit components are placed adjacent to the vapor chamber;
one or more fans located adjacent to the heat exchanger to provide airflow through the interior; and
a plurality of internal wall spikes included on at least one of the base chassis or the lid and positioned downstream of the vapor chamber with respect to the airflow through the interior and configured to absorb residual heat from the airflow.