US 12,238,400 B1
Dynamic flexible printed circuit for a tip tilt OIS camera module
Andrew S Jozefov, Palo Alto, CA (US); Zachary W Birnbaum, Saratoga, CA (US); and Scott W Miller, Los Gatos, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on May 20, 2022, as Appl. No. 17/664,371.
Claims priority of provisional application 63/209,874, filed on Jun. 11, 2021.
Int. Cl. H04N 23/57 (2023.01); H04N 23/695 (2023.01)
CPC H04N 23/57 (2023.01) [H04N 23/695 (2023.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a camera module including an image sensor and one or more lenses, wherein the camera module is suspended from a base structure via one or more stages and configured to rotate using the one or more stages relative to the base structure around one or more axes orthogonal to an optical axis of one or more lenses of the camera module; and
a printed circuit structure, comprising:
a first flexible portion surrounding an outside perimeter of the camera module along the one or more axes; and
a second flexible portion attached to the camera module to connect the camera module with the first flexible portion of the printed circuit structure,
wherein the printed circuit structure is configured to route one or more electrical signals through the printed circuit structure between the camera module and at least one component outside the camera module.