US 12,237,849 B2
Devices and methods related to integrated front-end architecture modules for carrier aggregation
Srivatsan Jayaraman, Santa Clara, CA (US); Omar Mustafa, Sunnyvale, CA (US); Yalin Jin, San Jose, CA (US); Ethan Chang, Aliso Viejo, CA (US); Ying Shi, Saratoga, CA (US); Reza Kasnavi, Solana Beach, CA (US); Philip H. Thompson, Cedar Rapids, IA (US); and Kenneth Norman Warren, Anamosa, IA (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on Apr. 21, 2023, as Appl. No. 18/137,705.
Application 18/137,705 is a continuation of application No. 17/103,546, filed on Nov. 24, 2020, granted, now 11,664,829.
Application 17/103,546 is a continuation of application No. 15/276,662, filed on Sep. 26, 2016, abandoned.
Claims priority of provisional application 62/248,412, filed on Oct. 30, 2015.
Claims priority of provisional application 62/233,671, filed on Sep. 28, 2015.
Prior Publication US 2023/0387944 A1, Nov. 30, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 1/00 (2006.01); H04B 7/04 (2017.01); H04W 52/52 (2009.01); H04W 84/04 (2009.01)
CPC H04B 1/0057 (2013.01) [H04B 7/04 (2013.01); H04W 52/52 (2013.01); H04W 84/042 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of implementing a radio-frequency module comprising:
providing a packaging substrate configured to receive a plurality of components;
providing a first die implemented on the packaging substrate, the first die including a first antenna switch module configured to provide switching for a first frequency band, the first antenna switch module coupled to a first node associated with a first antenna, the first die including a first coupler configured to couple a signal associated with the first antenna switch module;
providing a second die implemented on the packaging substrate, the second die including a second antenna switch module configured to provide switching for a second frequency band and a third antenna switch module configured to provide switching for a third frequency band, the second antenna switch module coupled to the first node associated with the first antenna, the third antenna switch module coupled to a second node associated with a second antenna, the second die including a second coupler configured to couple a signal associated with the second antenna switch module and a third coupler configured to couple a signal associated with the third antenna switch module;
providing a third die implemented on the packaging substrate, the third die including a diplexer circuit including a first filter coupled to the first antenna switch module and configured to pass the first frequency band, a second filter coupled to the second antenna switch module and configured to pass the second frequency band, a first electrostatic discharge network configured to dissipate electrostatic energy associated with the first frequency band and the second frequency band from the first node associated with the first antenna, the first electrostatic discharge network coupled to the first filter and the second filter, and a second electrostatic discharge network configured to dissipate electrostatic energy associated with the third frequency band from the second node associated with the second antenna; and
providing a multiplexor assembly configured to select a signal from one of the first coupler or the second coupler for output to a coupler output node.