US 12,237,780 B2
MEMS assembly and process flow
Matthew Ng, Rosemead, CA (US); Xiaolei Liu, South Pasadena, CA (US); and Guiqin Wang, Arcadia, CA (US)
Assigned to MEMS DRIVE (NANJING) CO., LTD., Nanjing (CN)
Filed by MEMS DRIVE (NANJING) CO., LTD., Nanjing (CN)
Filed on Sep. 29, 2022, as Appl. No. 17/936,699.
Claims priority of provisional application 63/249,871, filed on Sep. 29, 2021.
Prior Publication US 2023/0097412 A1, Mar. 30, 2023
Int. Cl. H02N 1/00 (2006.01); G02B 27/64 (2006.01); H04N 23/68 (2023.01)
CPC H02N 1/008 (2013.01) [G02B 27/646 (2013.01); H04N 23/687 (2023.01)] 19 Claims
OG exemplary drawing
 
1. A temporary MEMS-based locking assembly configured to temporarily compress electrically conductive flexures comprising:
a first locking structure coupled to a first portion of a MEMS conductive assembly;
a second locking structure coupled to a second portion of the MEMS conductive assembly, wherein:
the electrically conductive flexures are positioned between the first portion of the MEMS conductive assembly and the second portion of the MEMS conductive assembly, and
the first and second locking structures are configured to engage each other upon the compression of the electrically conductive flexures to effectuate the locking of the first portion of the MEMS conductive assembly with respect to the second portion of the MEMS conductive assembly.