US 12,237,618 B2
Interface card assembly and circuit board module using the same
Po-Ting Chen, Taipei (TW); Chang-Hung Chen, Taipei (TW); and Chih-Hung Chuang, Taipei (TW)
Assigned to ASUSTeK COMPUTER INC., Taipei (TW)
Filed by ASUSTeK COMPUTER INC., Taipei (TW)
Filed on Jun. 8, 2022, as Appl. No. 17/834,947.
Claims priority of application No. 110132981 (TW), filed on Sep. 6, 2021.
Prior Publication US 2023/0072319 A1, Mar. 9, 2023
Int. Cl. H01R 13/639 (2006.01); H01R 12/73 (2011.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01)
CPC H01R 13/639 (2013.01) [H01R 12/73 (2013.01); H05K 1/18 (2013.01); H05K 7/20509 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/2036 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An interface card assembly, adapted for fixing an M.2 interface card to a circuit board body with an M.2 connector, the M.2 interface card having a connecting end and an end, the interface card assembly comprising:
a heat dissipation plate, disposed at a position adjacent to the M.2 connector, wherein the heat dissipation plate comprises a hole; and
a fastener, detachably disposed in the hole, wherein the fastener comprises a main body and a cantilever, and a clamping part is disposed between the main body and the cantilever,
wherein when the M.2 interface card is inserted into the M.2 connector through the connecting end, the fastener moves relative to the heat dissipation plate at the end, so that the M.2 interface card extends into the clamping part and is clamped between the main body and the cantilever,
wherein the main body comprises a first surface and a second surface opposite to each other,
the cantilever is located on the first surface,
the fastener further comprises a necked section protruding from the second surface and a stop part connected to the necked section,
the necked section is located in the hole, and
the stop part is located between the heat dissipation plate and the circuit board body.