US 12,237,599 B2
Socket
Toshiyasu Ito, Tokyo (JP)
Assigned to YAMAICHI ELECTRONICS CO., LTD., Tokyo (JP); and Huawei Technologies Co., Ltd., Guangdong (CN)
Filed by YAMAICHI ELECTRONICS CO., LTD., Tokyo (JP); and Huawei Technologies Co., Ltd., Guangdong (CN)
Filed on Jul. 25, 2022, as Appl. No. 17/814,705.
Claims priority of application No. 202110852075.2 (CN), filed on Jul. 27, 2021.
Prior Publication US 2023/0029598 A1, Feb. 2, 2023
Int. Cl. H01R 12/70 (2011.01); H01R 13/11 (2006.01)
CPC H01R 12/707 (2013.01) [H01R 13/11 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A socket, comprising:
a housing which is formed in a box-shape with an opening and provided with a matrix of through holes at a bottom portion; and
a plurality of contacts comprising ground contacts and signal contacts which are arranged so as to be aligned alternately in a predetermined array direction by one or a plurality of the contacts and are passed through the through holes,
wherein
the ground contacts adjacent to each other in the array direction are short-circuited,
connecting portions connecting a plurality of ground contacts adjacent to each other in the array direction are provided to the contacts,
and wherein
the connecting portion is a bar extending in the array direction, and
the bar is fixed to the plurality of ground contacts adjacent to each other in the array direction in such a manner that a rear surface of the bar is in contact with corresponding surfaces of the adjacent ground contacts.