US 12,237,590 B2
Printed circuit board integrated antenna for transmitting / receiving data
Anton Sergeevich Lukyanov, Moscow (RU); and Mikhail Nikolaevich Makurin, Moscow (RU)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Dec. 2, 2022, as Appl. No. 18/073,966.
Application 18/073,966 is a continuation of application No. PCT/KR2022/019447, filed on Dec. 2, 2022.
Claims priority of application No. RU2021135450 (RU), filed on Dec. 2, 2021.
Prior Publication US 2023/0178884 A1, Jun. 8, 2023
Int. Cl. H01Q 9/04 (2006.01); H01Q 1/22 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC H01Q 9/0414 (2013.01) [H01Q 1/2283 (2013.01); H05K 1/0243 (2013.01); H05K 1/025 (2013.01); H05K 1/115 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/10098 (2013.01)] 17 Claims
OG exemplary drawing
 
1. Printed circuit board-integrated antenna configured to transmit/receive data, the antenna being formed on adjacent layers of said printed circuit board, the adjacent layers being interconnected by a plurality of vias to form a conductive solid area, wherein said adjacent layers of the printed circuit board comprise a lower layer, a lower middle layer, an upper middle layer, and an upper layer, the antenna comprising:
an intermediate section comprising first and second patch elements interconnected by at least one via, wherein the first patch element is disposed in the lower middle layer and separated by a gap from the conductive solid area, the second patch element is disposed in the upper middle layer and separated by a gap from the conductive solid area;
a parasitic patch element disposed in the upper layer and separated by a gap from the conductive solid area; and
a strip line connected directly to an edge of the first patch element, the strip line being disposed in the lower middle layer configured to communicate a data signal to or from the intermediate section when transmitting/receiving data.