CPC H01Q 3/28 (2013.01) [H01Q 3/36 (2013.01); H01Q 9/0414 (2013.01); H04W 52/32 (2013.01); H04W 52/367 (2013.01); H01Q 21/065 (2013.01); H04B 7/0413 (2013.01); H04B 7/043 (2013.01); H04B 7/0602 (2013.01); H04W 16/28 (2013.01)] | 20 Claims |
1. A module for a communications device, the module comprising:
a substrate;
a first antenna array formed on the substrate, the first antenna array including a first plurality of antenna elements;
a semiconductor die attached to the substrate and including a plurality of signal conditioning circuits, each signal conditioning circuit including at least one of a transmit conditioning circuit or a receive conditioning circuit, each conditioning circuit operatively associated with a corresponding one of the first plurality of antenna elements, and the semiconductor die further including an antenna array management circuit configured to individually control activation of the plurality of signal conditioning circuits to dynamically activate a corresponding pattern of activated antenna elements; and
tuning control circuitry configured to dynamically tune an input impedance or an output impedance of the activated signal conditioning circuits.
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