	US 12,237,574 B2
	Assembly with at least one antenna and a thermal insulation component
Jacob B. Hersh, Newark, DE (US); John C. Allen, Newark, DE (US); Mitchell H. Warren, Newark, DE (US); and Lindsey C. Keen, Newark, DE (US)
Assigned to W. L. Gore & Associates, Inc., Newark, DE (US)
Filed by W. L. Gore & Associates, Inc., Newark, DE (US)
Filed on Apr. 23, 2021, as Appl. No. 17/238,566.
Application 17/238,566 is a continuation of application No. 16/870,707, filed on May 8, 2020, granted, now 11,050,144.
Prior Publication US 2021/0351501 A1, Nov. 11, 2021
Int. Cl. H01Q 1/38 (2006.01); B01J 13/00 (2006.01); H01Q 1/40 (2006.01); H05K 5/02 (2006.01)

CPC H01Q 1/405 (2013.01) [B01J 13/0091 (2013.01); H05K 5/0213 (2013.01)]

27 Claims

1. An assembly comprising:

at least one antenna, wherein the at least one antenna is configured to transmit a field of radiofrequency (RF) communication at an operating frequency ranging from 6 GHz to 100 GHz; and

a thermal insulation component comprising a thermal insulation layer and a protective film,

wherein the thermal insulation component is disposed within the field of RF communication, and

wherein the thermal insulation layer has a thermal conductivity of 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm, and a thickness of 0.03 mm to 2 mm;

wherein the assembly is disposed within an enclosure,

wherein an adhesive bonds the thermal insulation component between the at least one antenna and the enclosure, and

wherein the thermal insulation component has a dielectric constant ranging from 1.05 to 4 measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a split Post Dielectric Resonator (SPDR).