US 12,237,561 B2
Circuit board assembly and electronic device including the same
Jongwon Lee, Gyeonggi-do (KR); and Dongil Son, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd, (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on May 18, 2023, as Appl. No. 18/319,648.
Application 18/319,648 is a continuation of application No. 16/659,075, filed on Oct. 21, 2019, granted, now 11,677,132.
Claims priority of application No. 10-2018-0125148 (KR), filed on Oct. 19, 2018.
Prior Publication US 2023/0291090 A1, Sep. 14, 2023
Int. Cl. H01Q 1/02 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 9/00 (2006.01)
CPC H01Q 1/02 (2013.01) [H01Q 1/2283 (2013.01); H01Q 23/00 (2013.01); H05K 1/0203 (2013.01); H05K 1/0243 (2013.01); H05K 1/112 (2013.01); H05K 1/147 (2013.01); H05K 1/181 (2013.01); H05K 9/0024 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10734 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first circuit board including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction;
a second circuit board including a third surface facing the first direction and a fourth surface facing the second direction;
an interposer disposed between the first circuit board and the second circuit board;
an antenna disposed at the first surface of the first circuit board;
a first electronic component disposed on the second surface of the first circuit board and electrically connected with the antenna; and
a thermal interface material (TIM) disposed between the second surface of the first circuit board and the third surface of the second circuit board and contacting a surface of the first electronic component.