US 12,237,454 B2
Electronic device and manufacturing method thereof
Ming-Chang Lin, Miao-Li County (TW)
Assigned to InnoLux Corporation, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Nov. 17, 2021, as Appl. No. 17/529,166.
Claims priority of application No. 202011496251.5 (CN), filed on Dec. 17, 2020.
Prior Publication US 2022/0199875 A1, Jun. 23, 2022
Int. Cl. H01L 33/62 (2010.01); H01L 33/00 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 33/005 (2013.01); H01L 2933/0066 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A manufacturing method of an electronic device, comprising:
providing a substrate;
forming a first compressible layer on the substrate;
forming a first bonding pad on the first compressible layer;
providing an electronic component;
forming a second bonding pad on the electronic component; and
bonding the electronic component with the substrate by contacting the second bonding pad with the first bonding pad,
wherein a material of the first bonding pad and a material of the second bonding pad are the same.