US 12,237,452 B2
Light emitting diode (LED) package and method for manufacturing the same
Jianbin Tu, Xiamen (CN); Junpeng Shi, Xiamen (CN); Weng-Tack Wong, Xiamen (CN); Yanqiu Liao, Xiamen (CN); and Chen-ke Hsu, Xiamen (CN)
Assigned to QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD., Quanzhou (CN)
Filed by Quanzhou Sanan Semiconductor Technology Co., Ltd., Quanzhou (CN)
Filed on Jul. 14, 2021, as Appl. No. 17/375,246.
Application 17/375,246 is a continuation in part of application No. PCT/CN2019/111374, filed on Oct. 16, 2019.
Prior Publication US 2021/0343916 A1, Nov. 4, 2021
Int. Cl. H01L 33/62 (2010.01); H01L 33/52 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 33/52 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A light emitting diode (LED) package comprising:
a substrate having an upper surface, and a lower surface opposite to said upper surface;
a metal stage formed on said upper surface of said substrate;
at least one LED chip mounted on said metal stage; and
a packaging material covering said LED chip, said metal stage and said substrate, said packaging material and said metal stage being engaged with each other;
wherein said metal stage includes a chip-mounting region for mounting said LED chip thereon, and a boundary region;
wherein said boundary region is located at a periphery of said metal stage;
wherein said boundary region includes a boundary section that is spaced apart from said chip-mounting region;
wherein electric connection between said boundary section and said chip-mounting region is not established so that said boundary section is electrically insulated from said LED chip; and
wherein said boundary section has an enclosed structure continuously surrounding said chip-mounting region, said boundary section having one of a through hole and a comb structure.