US 12,237,451 B2
Arrangements of light-altering coatings in light-emitting diode packages
Joseph M. Favale, Jr., Cary, NC (US); and Robert David Schmidt, Wake Forest, NC (US)
Assigned to CreeLED, Inc., Durham, NC (US)
Filed by CreeLED, Inc., Durham, NC (US)
Filed on Jan. 28, 2022, as Appl. No. 17/587,215.
Prior Publication US 2023/0246144 A1, Aug. 3, 2023
Int. Cl. H01L 33/60 (2010.01); H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/60 (2013.01) [H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light-emitting diode (LED) package comprising:
a housing that forms a recess with a recess floor and one or more recess sidewalls;
a lead frame structure extending through the housing, wherein a portion of the lead frame structure is arranged along the recess floor;
at least one LED chip arranged within the recess and electrically coupled with the lead frame structure; and
a light-altering coating arranged on the one or more recess sidewalls, the recess floor, and the portion of the lead frame structure that is arranged along the recess floor;
wherein the light-altering coating is arranged on sides of the at least one LED chip at a height above the recess floor that is in range from 50% to 90% of a corresponding height of the at least one LED chip above the recess floor.