US 12,237,444 B2
Radiation-emitting component and method for producing a radiation-emitting component
Luca Haiberger, Regensburg (DE); and Sam Chou, Regensburg (DE)
Assigned to OSRAM OLED GMBH, Regensburg (DE)
Filed by OSRAM OLED GmbH, Regensburg (DE)
Filed on Oct. 18, 2023, as Appl. No. 18/489,511.
Application 18/489,511 is a continuation of application No. 16/969,748, granted, now 11,824,142, previously published as PCT/EP2019/052750, filed on Feb. 5, 2019.
Claims priority of application No. 102018103748.1 (DE), filed on Feb. 20, 2018.
Prior Publication US 2024/0047625 A1, Feb. 8, 2024
Int. Cl. H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01)
CPC H01L 33/486 (2013.01) [H01L 33/60 (2013.01); H01L 33/50 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0091 (2013.01)] 13 Claims
OG exemplary drawing
 
1. Radiation-emitting component with
a carrier having a cavity,
a radiation-emitting semiconductor chip which is arranged on a bottom surface delimiting the cavity and which is configured to generate primary electromagnetic radiation, and
a first reflector layer arranged above a top surface of the semiconductor chip,
wherein
the carrier has at least one side wall and a bottom,
the carrier is transparent in places to the primary electromagnetic radiation,
the semiconductor chip is spaced apart from at least one side surface delimiting the cavity,
the side wall has a transparent part and a reflective part,
a top surface of the reflective part extends obliquely to the bottom surface, and
the transparent part is arranged on the top surface of the reflective part.