US 12,237,443 B2
Printed components in device pockets
António José Marques Trindade, Cork (IE); Alexandre Chikhaoui, Kehl (DE); Ronald S. Cok, Rochester, NY (US); Robert R. Rotzoll, Colorado Springs, CO (US); Raja Fazan Gul, Cork (IE); and Lei Liu, Cork (IE)
Assigned to X-Celeprint Limited, Dublin (IE)
Filed by X-Celeprint Limited, Dublin (IE)
Filed on Feb. 15, 2022, as Appl. No. 17/672,396.
Prior Publication US 2023/0261149 A1, Aug. 17, 2023
Int. Cl. H01L 33/48 (2010.01); H01L 25/075 (2006.01)
CPC H01L 33/483 (2013.01) [H01L 25/0753 (2013.01); H01L 2933/0033 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A micro-device structure, comprising:
an insulating layer;
a micro-device disposed on the insulating layer, the micro-device comprising a pocket formed in the micro-device extending from a surface of the micro-device opposite the insulating layer through the micro-device to the insulating layer; and
a micro-component disposed in the pocket, wherein the micro-component is non-native to the micro-device and is non-native to the insulating layer,
wherein the micro-component is electrically connected to the micro-device.