| CPC H01L 33/10 (2013.01) [G02B 6/0073 (2013.01); H01L 33/007 (2013.01); H01L 33/0075 (2013.01); H01L 33/20 (2013.01); H01L 33/60 (2013.01)] | 20 Claims |
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1. A light-emitting package, comprising:
a housing comprising an opening;
a lead frame covered by the housing;
a light-emitting device mounted in the opening and electrically connected to the lead frame, the light-emitting device comprising:
a substrate comprising:
a base comprising a main surface, wherein the main surface comprises a central area and a peripheral area surrounding the central area; and
a plurality of protrusions separately disposed on and contacting the central area of the main surface, wherein the plurality of protrusions and the base comprise different materials; and
a semiconductor stack on the central area and covering the plurality of protrusions, wherein the semiconductor stack comprises a bottom surface overlapping the central area and a side wall connecting to the bottom surface,
wherein an obtuse angle is formed between the side wall and the bottom surface;
and wherein the peripheral area is not covered by the semiconductor stack, and the peripheral area is devoid of the plurality of protrusions formed thereon,
wherein the semiconductor stack comprises a plurality of holes on the side wall near the bottom surface, and
wherein one of the plurality of holes is devoid of one of the plurality of protrusions being disposed therein; and
a filling material filling in the opening and covering the light-emitting device.
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