CPC H01L 29/66795 (2013.01) [H01L 21/02164 (2013.01); H01L 21/02271 (2013.01); H01L 21/02381 (2013.01); H01L 21/02532 (2013.01); H01L 21/3003 (2013.01); H01L 21/3065 (2013.01); H01L 21/31053 (2013.01); H01L 21/31116 (2013.01); H01L 21/76224 (2013.01); H01L 29/0847 (2013.01); H01L 29/165 (2013.01); H01L 29/401 (2013.01); H01L 29/66545 (2013.01); H01L 29/7833 (2013.01); H01L 29/7851 (2013.01); H01L 21/26513 (2013.01); H01L 29/6656 (2013.01); H01L 29/66636 (2013.01)] | 20 Claims |
1. A method comprising:
forming a fin that protrudes from a substrate, a top portion of the fin comprising a first semiconductor material, wherein a bottom portion of the fin and the substrate comprise a second semiconductor material different from the first semiconductor material; and
exposing a top surface and sidewalls of the top portion of the fin to a hydrogen plasma, wherein after exposing the top surface and the sidewalls of the top portion of the fin to the hydrogen plasma, a germanium concentration increases in a direction extending from a center portion of the top portion of the fin to edge portions of the top portion of the fin.
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