| CPC H01L 29/36 (2013.01) [H01L 21/02532 (2013.01); H01L 21/26506 (2013.01); H01L 29/0657 (2013.01); H01L 29/167 (2013.01); H01L 29/41791 (2013.01); H01L 29/66795 (2013.01); H01L 29/7848 (2013.01); H01L 29/785 (2013.01)] | 20 Claims |

|
1. A method of manufacturing a semiconductor device, the method comprising:
forming a semiconductor fin on a substrate, the semiconductor fin comprising a first material; and
embedding a second material different from the first material within the semiconductor fin, wherein the second material has a series of concentration gradients comprising in order from a top region of the second material towards a bottom of the second material a first concentration gradient, a second concentration gradient opposite the first concentration gradient, a third concentration gradient opposite the second concentration gradient, and a fourth concentration gradient opposite the third concentration gradient.
|