US 12,237,354 B2
Chip package and method for forming the same
Tsang-Yu Liu, Zhubei (TW); Shu-Ming Chang, New Taipei (TW); and Chaung-Lin Lai, Taoyuan (TW)
Assigned to Xintec Inc., Taoyuan (TW)
Filed by XINTEC INC., Taoyuan (TW)
Filed on Mar. 1, 2022, as Appl. No. 17/683,917.
Claims priority of provisional application 63/155,747, filed on Mar. 3, 2021.
Prior Publication US 2022/0285423 A1, Sep. 8, 2022
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14632 (2013.01) [H01L 27/14601 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14689 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A chip package, comprising:
a substrate having a first surface and a second surface opposite the first surface of the substrate, and having a sensing region in the substrate;
a dielectric layer having a first surface and a second surface opposite the first surface of the dielectric layer, wherein the first surface of the dielectric layer adjoins the second surface of the substrate; and
an optical element disposed over the substrate and aligned with the sensing region,
wherein a width of the first surface of the dielectric layer is different than a width of the first surface of the substrate, and the dielectric layer has a tilted sidewall surface surrounding the optical element and the sensing region.