US 12,237,320 B2
Package structure and method of forming the same
Wei-Hung Lin, Hsinchu County (TW); Hui-Min Huang, Taoyuan (TW); Chang-Jung Hsueh, Taipei (TW); Wan-Yu Chiang, Hsinchu (TW); Ming-Da Cheng, Taoyuan (TW); and Mirng-Ji Lii, Hsinchu County (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Nov. 21, 2023, as Appl. No. 18/515,274.
Application 18/515,274 is a continuation of application No. 17/460,347, filed on Aug. 30, 2021, granted, now 11,855,058.
Prior Publication US 2024/0088119 A1, Mar. 14, 2024
Int. Cl. H01L 25/18 (2023.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 25/18 (2013.01) [H01L 21/78 (2013.01); H01L 23/3107 (2013.01); H01L 23/49838 (2013.01); H01L 24/96 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of forming a package structure, comprising:
providing a first package having a plurality of system on a chip (SoC) dies therein;
performing a mechanical sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three SoC dies and an encapsulant laterally encapsulating the three SoC dies; and
performing a laser cutting process to remove a portion of the encapsulant of the one of the plurality of second packages, so that a cut second package is formed into a L-shaped package.