US 12,237,313 B2
Lighting-emitting device filament including electrode pads
Jae Hyun Park, Ansan-si (KR); Seong Jin Lee, Ansan-si (KR); and Jong Kook Lee, Ansan-si (KR)
Assigned to SEOUL SEMICONDUCTOR CO., LTD., Ansan-si (KR)
Filed by SEOUL SEMICONDUCTOR CO., LTD., Ansan-si (KR)
Filed on Dec. 7, 2022, as Appl. No. 18/077,118.
Application 18/077,118 is a continuation of application No. 17/734,573, filed on May 2, 2022, granted, now 11,527,517.
Application 17/734,573 is a continuation of application No. 17/186,879, filed on Feb. 26, 2021, granted, now 11,348,907, issued on May 31, 2022.
Application 17/186,879 is a continuation of application No. 16/823,949, filed on Mar. 19, 2020, granted, now 10,957,675, issued on Mar. 23, 2021.
Application 16/823,949 is a continuation of application No. PCT/KR2018/013156, filed on Nov. 1, 2018.
Claims priority of application No. 10-2017-0149894 (KR), filed on Nov. 10, 2017.
Prior Publication US 2023/0100018 A1, Mar. 30, 2023
Int. Cl. H01L 25/075 (2006.01); F21K 9/232 (2016.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 33/22 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01)
CPC H01L 25/0753 (2013.01) [F21K 9/232 (2016.08); H01L 23/5387 (2013.01); H01L 23/562 (2013.01); H01L 33/22 (2013.01); H01L 33/50 (2013.01); H01L 33/62 (2013.01); H01L 2933/0091 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light emitting device, comprising:
a substrate comprising a first surface and a second surface opposite to the first surface, the substrate extending in a first direction and having a width in a second direction;
a plurality of light emitting diodes disposed on the first surface of the substrate;
two electrode pads disposed on the substrate and including a first electrode pad and a second electrode pad;
a first solder and a second solder that include conductive materials and provided on a first terminal and a second terminal, respectively, the first terminal and the second terminal electrically coupled to electrodes of a light emitting diode;
a plurality of connection lines electrically connecting the plurality of light emitting diodes and the two electrode pads; and
an insulating layer disposed on the substrate to cover the plurality of light emitting diodes and including a first insulating layer and a second insulating layer,
wherein the plurality of connection lines includes a first connection line and a second connection line, and
wherein:
the first connection line connects at least two neighboring light emitting diodes among the plurality of light emitting diodes,
the second connection line connects the first electrode pad and a light emitting diode among the plurality of light emitting diodes which is positioned adjacent to the first electrode pad, and
the first insulating layer is provided only on a first region of the substrate without being disposed on a second region of the substrate, and wherein the first electrode pad and the second electrode pad are spaced apart from the first insulating layer, and
wherein the first terminal and the second terminal are attached, through the first solder and the second solder, to at least one of the first connection line or the second connection line that is disposed on the substrate.