US 12,237,309 B2
Semiconductor package having pads with stepped structure
Myung Kee Chung, Hwaseong-si (KR); Hyun Soo Chung, Hwaseong-si (KR); and Tae Won Yoo, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 14, 2024, as Appl. No. 18/605,573.
Application 18/605,573 is a continuation of application No. 18/092,994, filed on Jan. 4, 2023, granted, now 11,955,464.
Application 18/092,994 is a continuation of application No. 17/216,334, filed on Mar. 29, 2021, granted, now 11,574,892, issued on Feb. 7, 2023.
Claims priority of application No. 10-2020-0112294 (KR), filed on Sep. 3, 2020.
Prior Publication US 2024/0222334 A1, Jul. 4, 2024
Int. Cl. H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 25/0657 (2013.01) [H01L 25/50 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06586 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a first semiconductor chip having a first surface and a second surface opposite to the first surface, and including a first pad disposed on the first surface and a second pad disposed on the first surface, the first pad being spaced apart from the second pad; and
a second semiconductor chip having a third surface facing the first surface of the first semiconductor chip and a fourth surface opposite to the third surface, and including a third pad disposed beneath the third surface and a fourth pad disposed beneath the third surface, the third pad being spaced apart from the fourth pad,
wherein the first pad includes a first metal and a second metal, and the first metal is coupled to the third pad via the second metal,
the second pad is coupled to the fourth pad via a first solder ball, and
a width of the first solder ball is greater than a width of the second pad and a width of the fourth pad, respectively.