US 12,237,303 B2
Vertically mounted die groups
Jen-Yuan Chang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 26, 2024, as Appl. No. 18/587,908.
Application 18/587,908 is a continuation of application No. 17/534,395, filed on Nov. 23, 2021, granted, now 11,929,348.
Claims priority of provisional application 63/186,043, filed on May 7, 2021.
Prior Publication US 2024/0194644 A1, Jun. 13, 2024
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/0652 (2013.01) [H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/50 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06555 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a base substrate structure; and
a plurality of die groups disposed on a top surface of the based substrate structure, the plurality of die groups comprising a first die group and a second die group, the second die group being a neighboring die group of the first die group;
wherein the first die group includes a plurality of first dies stacked parallel to each other and parallel to a front surface of the first die group, the front surface of the first die group and the top surface of the base substrate structure intersect at a first edge, and the first edge extends in a first direction in the top surface of the base substrate structure;
wherein the second die group includes a plurality of second dies stacked parallel to each other and parallel to a front surface of the second die group, the front surface of the second die group and the top surface of the base substrate structure intersect at a second edge, the second edge extends in a second direction in the top surface of the base substrate structure; and
wherein the first direction is not parallel to the second direction.