US 12,237,300 B2
Through-substrate void filling for an integrated circuit assembly
Tyler Leuten, Orangeville, CA (US); Yi Xu, Folsom, CA (US); and Eleanor Patricia Paras Rabadam, Folsom, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 7, 2020, as Appl. No. 17/113,341.
Prior Publication US 2022/0181294 A1, Jun. 9, 2022
Int. Cl. H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/52 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)
CPC H01L 25/0652 (2013.01) [H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 23/3135 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/48 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17135 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit assembly, comprising:
an electronic substrate having a first substrate surface opposing a second substrate surface, wherein the electronic substrate includes an opening extending from the first substrate surface to the second substrate surface;
an integrated circuit die attached to the electronic substrate, wherein the integrated circuit die has a first die surface opposing a second die surface that faces the first substrate surface; and
a body of fill material in direct contact with the first substrate surface and in direct contact with the integrated circuit die, wherein a portion of the body of fill material extends into the opening in the electronic substrate; and
a body of mold material over a portion of the first substrate surface beyond a side of the integrated circuit die and over at least a portion of the first die surface.