US 12,237,296 B2
System for laser bonding of flip chip
Youn Sung Ko, Chungcheongnam-do (KR); and Geunsik Ahn, Seoul (KR)
Assigned to PROTEC CO., LTD., Gyeonggi-do (KR)
Filed by PROTEC CO., LTD., Gyeonggi-do (KR)
Filed on Nov. 1, 2021, as Appl. No. 17/516,620.
Application 17/516,620 is a continuation of application No. PCT/KR2019/006792, filed on Jun. 5, 2019.
Claims priority of application No. 10-2019-0052270 (KR), filed on May 3, 2019.
Prior Publication US 2022/0052019 A1, Feb. 17, 2022
Int. Cl. H01L 23/00 (2006.01); B23K 1/005 (2006.01); B23K 26/03 (2006.01); B23K 26/06 (2014.01); B23K 26/18 (2006.01); B23K 26/324 (2014.01); B23K 37/04 (2006.01); H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01S 3/101 (2006.01); B23K 26/08 (2014.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01)
CPC H01L 24/75 (2013.01) [B23K 1/0056 (2013.01); B23K 26/032 (2013.01); B23K 26/034 (2013.01); B23K 26/0626 (2013.01); B23K 26/18 (2013.01); B23K 26/324 (2013.01); B23K 37/0435 (2013.01); H01L 21/56 (2013.01); H01L 21/67 (2013.01); H01L 21/67276 (2013.01); H01S 3/101 (2013.01); B23K 26/0869 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); H01L 2224/75263 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75901 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A system for laser bonding of flip chip comprising:
a supply unit configured to supply a substrate, on which a plurality of semiconductor chips to be bonded to an upper surface of the substrate are arranged;
a fixing unit configured to receive the substrate from the supply unit and fix a lower surface of the substrate;
a laser unit comprising a laser head for bonding the semiconductor chips to the substrate by irradiating a laser beam to the substrate fixed to the fixing unit and a laser transporting portion transporting the laser head;
a mask comprising a transmitting portion configured to transmit through a laser beam irradiated from the laser head of the laser unit and transmit through infrared rays including a wavelength band from about 3 μm or more to about 9 μm or less;
a mask holding unit configured to hold the mask above the fixing unit;
a pressurizing unit configured to lift one of the mask holding unit and the fixing unit relative to the other such that the transmitting portion of the mask pressurizes a plurality of semiconductor chips of the substrate fixed to the fixing unit;
a discharging unit configured to receive the substrate from the fixing unit and discharge the substrate;
an infrared camera configured to capture an image of the semiconductor chips to which a laser beam is irradiated by the laser head of the laser unit; and
a controller configured to control operation of the supply unit, the fixing unit, and the discharging unit, and control operation of the laser head of the laser unit by using a value measured by the infrared camera.