US 12,237,295 B2
Flip chip laser bonding system
Geunsik Ahn, Seoul (KR)
Assigned to PROTEC CO., LTD., Gyeonggi-do (KR)
Filed by PROTEC CO., LTD., Gyeonggi-do (KR)
Filed on Jul. 1, 2021, as Appl. No. 17/365,995.
Application 17/365,995 is a continuation of application No. PCT/KR2019/006786, filed on Jun. 5, 2019.
Claims priority of application No. 10-2019-0001170 (KR), filed on Jan. 4, 2019.
Prior Publication US 2021/0335749 A1, Oct. 28, 2021
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/75 (2013.01) [H01L 24/81 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/3511 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A flip-chip laser bonding system, comprising:
a supply unit comprising belts that support opposite sides of a substrate configured to supply the substrate on which a plurality of semiconductor chips, which are to be bonded to an upper surface of the substrate, are disposed;
a fixing unit comprising a substrate holder configured to receive the substrate from the supply unit and fix a lower surface of the substrate;
a laser unit including
a laser head for irradiating the substrate fixed on the fixing unit with a laser beam to bond the semiconductor chips to the substrate, and
a laser transport unit comprising a laser head holder, and a moving rail for transporting the laser head;
a mask having a plurality of transmission portions that transmit a laser beam radiated from the laser head of the laser unit;
a mask mounting unit comprising a mask holder for supporting the mask is configured to mount the mask above the fixing unit;
a discharge unit configured to receive the substrate from the fixing unit and discharge the substrate;
a controller configured to control the operations of the supply unit, the fixing unit, the laser unit, and the discharge unit; and
a pressing unit comprising a stage for placing the substrate configured to raise or lower one of the mask mounting unit and the fixing unit with respect to the other so that the plurality of transmission portions of the mask presses the plurality of semiconductor chips of the substrate fixed on the fixing unit,
wherein the mask further includes a mask body having a flat plate shape, and a plurality of transmission holes formed in the mask body, and the plurality of transmission portions are to be inserted into the plurality of transmission holes of the mask, respectively.