US 12,237,292 B2
Circuits including micropatterns and using partial curing to adhere dies
Teresa M. Goeddel, St. Paul, MN (US); Ankit Mahajan, Cupertino, CA (US); Mikhail L. Pekurovsky, Bloomington, MN (US); Saagar A. Shah, Minneapolis, MN (US); Kara A. Meyers, Oakdale, MN (US); and Christopher G. Walker, Edina, MN (US)
Assigned to 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
Appl. No. 17/756,208
Filed by 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
PCT Filed Nov. 30, 2020, PCT No. PCT/IB2020/061289
§ 371(c)(1), (2) Date May 19, 2022,
PCT Pub. No. WO2021/111279, PCT Pub. Date Jun. 10, 2021.
Claims priority of provisional application 62/943,427, filed on Dec. 4, 2019.
Prior Publication US 2022/0352108 A1, Nov. 3, 2022
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/27 (2013.01) [H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/211 (2013.01); H01L 2224/215 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27515 (2013.01); H01L 2224/29019 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/82102 (2013.01); H01L 2224/82104 (2013.01); H01L 2224/83856 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/3511 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method comprising:
disposing a layer of curable adhesive material on a substrate;
forming a pattern of microstructures on the layer of curable adhesive material;
curing a first region of the layer at a first level and a second region of the layer at a second level greater than the first level;
providing a solid circuit die to directly attach to a major surface of the first region of the layer; and
further curing the first region of the layer to anchor the solid circuit die on the first region by forming an adhesive bond therebetween.