US 12,237,289 B2
Flexible electronic structure including a support element
Brian Cobb, Sedgefield Durham (GB); and Richard Price, Sedgefield Durham (GB)
Assigned to PRAGMATIC SEMICONDUCTOR LIMITED, Cambridge (GB)
Appl. No. 17/611,611
Filed by PRAGMATIC SEMICONDUCTOR LIMITED, Cambridge (GB)
PCT Filed May 19, 2020, PCT No. PCT/GB2020/051221
§ 371(c)(1), (2) Date Nov. 16, 2021,
PCT Pub. No. WO2020/234582, PCT Pub. Date Nov. 26, 2020.
Claims priority of application No. 1907158 (GB), filed on May 21, 2019.
Prior Publication US 2022/0238472 A1, Jul. 28, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/522 (2006.01); H05K 1/18 (2006.01)
CPC H01L 24/19 (2013.01) [H01L 23/367 (2013.01); H01L 23/4985 (2013.01); H01L 23/5225 (2013.01); H01L 23/562 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/20 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 1/181 (2013.01); H01L 24/81 (2013.01); H01L 24/82 (2013.01); H01L 2224/03318 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/16268 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32268 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81898 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A flexible electronic structure configured to bond with an external circuit, the flexible electronic structure comprising:
a flexible body having a first surface, the flexible body comprising at least one electronic component;
at least one contact element configured to bond with the external circuit, the at least one contact element operatively coupled with the at least one electronic component and provided at the first surface of the flexible body, and arranged to operably interface with the external circuit after bonding, and
at least one support element provided at the first surface of the flexible body and in direct contact with the first surface of the flexible body, each support element arranged to contact a corresponding surface element disposed on a first surface of an external structure comprising the external circuit,
wherein the at least one contact element comprises a conductive metallic ink, and the at least one contact element is configured to sinter-bond, via the conductive metallic ink, to a corresponding external contact element disposed on the first surface of the external structure, and
wherein the at least one support element is thermally connected to the at least one electronic component and provides heat spreading or heat sinking for the at least one electronic component.