US 12,237,286 B2
High-speed die connections using a conductive insert
Rahul Agarwal, Livermore, CA (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Aug. 25, 2023, as Appl. No. 18/455,960.
Application 18/455,960 is a continuation of application No. 17/118,126, filed on Dec. 10, 2020, granted, now 11,749,629.
Prior Publication US 2023/0411331 A1, Dec. 21, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/528 (2006.01)
CPC H01L 24/13 (2013.01) [H01L 23/5283 (2013.01); H01L 24/05 (2013.01); H01L 24/81 (2013.01); H01L 2224/02331 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package for high-speed die connections, the semiconductor package comprising:
a die;
a plurality of redistribution layers;
a first conductive insert and a second conductive insert each housed in a perforation through the plurality of redistribution layers;
a first input/output connection point of the die conductively coupled to a conductive bump via the first conductive insert; and
a second input/output connection point of the die conductively coupled to the conductive bump via the second conductive insert.