US 12,237,281 B2
Electronic package and implantable medical device including same
Mark E. Henschel, Phoenix, AZ (US); and Songhua Shi, Tempe, AZ (US)
Assigned to Medtronic, Inc., Minneapolis, MN (US)
Filed by Medtronic, Inc., Minneapolis, MN (US)
Filed on Sep. 8, 2021, as Appl. No. 17/469,098.
Claims priority of provisional application 63/076,042, filed on Sep. 9, 2020.
Prior Publication US 2022/0077085 A1, Mar. 10, 2022
Int. Cl. H01L 21/00 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); A61N 1/375 (2006.01)
CPC H01L 24/02 (2013.01) [H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 24/06 (2013.01); A61N 1/3754 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/06182 (2013.01); H01L 2224/13026 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An implantable medical device comprising:
a power source;
an electronics module comprising an electronic package that comprises:
a monolithic package substrate comprising a first major surface and a second major surface;
an integrated circuit disposed in an active region of the package substrate; and
a conductive via disposed through an inactive region of the package substrate and extending between the first major surface and the second major surface of the package substrate, wherein the conductive via is separated from the active region by a portion of the inactive region of the substrate; and
a feedthrough header assembly electrically connected to the electronics module.