US 12,237,276 B2
Package structure
Po-Chen Lai, Hsinchu County (TW); Chin-Hua Wang, New Taipei (TW); Ming-Chih Yew, Hsinchu (TW); Che-Chia Yang, Taipei (TW); Shu-Shen Yeh, Taoyuan (TW); Po-Yao Lin, Hsinchu County (TW); and Shin-Puu Jeng, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 16, 2023, as Appl. No. 18/336,258.
Application 18/336,258 is a continuation of application No. 17/350,317, filed on Jun. 17, 2021, granted, now 11,721,643.
Prior Publication US 2023/0343724 A1, Oct. 26, 2023
Int. Cl. H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/562 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3512 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a semiconductor die bonding to a first surface of a redistribution structure, wherein the semiconductor die has a first sidewall and a second sidewall connected to the first sidewall; and
inner bonding elements bonding to a second surface of the redistribution structure and located within an area of the semiconductor die, wherein the inner bonding elements are defined into a first row of inner bonding elements and a second row of inner bonding elements, the first row and the second row extend parallel to the second sidewall, the second row is located between the first row and the second sidewall, and a minimum distance between the first row and the first sidewall is less than a minimum distance between the second row and the first sidewall,
wherein there are no inner bonding elements between the first row and the first sidewall, and there are no inner bonding elements between the second row and the first sidewall.