US 12,237,273 B2
Module
Mitsuo Ishido, Nagaokakyo (JP); Motohiko Kusunoki, Nagaokakyo (JP); and Minoru Komiyama, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Apr. 15, 2022, as Appl. No. 17/659,389.
Application 17/659,389 is a continuation of application No. PCT/JP2020/039690, filed on Oct. 22, 2020.
Claims priority of application No. 2019-202480 (JP), filed on Nov. 7, 2019.
Prior Publication US 2022/0238455 A1, Jul. 28, 2022
Int. Cl. H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01)
CPC H01L 23/552 (2013.01) [H01L 23/49811 (2013.01); H01L 25/16 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate having a first surface;
a first component and a second component, the first component and the second component being mounted on the first surface;
a first conductive material mounted between the first component and the second component on the first surface;
a first sealing resin provided on the first surface to cover the first component, the second component, and the first conductive material; and
a first shield film covering a surface of the first sealing resin, the surface of the first sealing resin being farther from the substrate, wherein
the first sealing resin has a recess to expose at least a part of the first conductive material,
the first shield film extends along an inner surface of the recess and is, thereby, electrically connected to the first conductive material,
the first shield film is disposed on an inside of the recess and is provided with an opening on an inside deepest part surface of the recess, and
a metal bump is disposed inside the recess, and the metal bump is electrically connected to the first conductive material through the opening provided on the first shield film.