US 12,237,272 B2
Electronic device and method of manufacturing the same
Hui-Ping Jian, Kaohsiung (TW); Ming-Hung Chen, Kaohsiung (TW); and Jia-Feng Ho, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Dec. 10, 2021, as Appl. No. 17/548,333.
Prior Publication US 2023/0187374 A1, Jun. 15, 2023
Int. Cl. H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01Q 1/22 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/561 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01Q 1/2283 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01)] 4 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a carrier having an antenna region, a first surface over the antenna region, a second surface above the first surface, and a lateral surface between the first surface and the second surface, wherein the first surface is substantially non-perpendicular to the second surface and a recess is recessed from the lateral surface into the carrier;
an encapsulant disposed on a first region of the second surface of the carrier;
a shielding element on the first surface and separated from the antenna region, wherein the shielding element is disposed on external surfaces of the encapsulant; and
an electronic component disposed on a second region of the second surface of the carrier and configured to electrically connect the carrier to an external element,
wherein the encapsulant comprises a first lateral surface facing the second region of the second surface of the carrier and a second lateral surface opposite to the first lateral surface, and wherein a slope of the first lateral surface is different from a slope of the second lateral surface.