US 12,237,271 B2
Module and method of manufacturing the same
Tadashi Nomura, Nagaokakyo (JP); and Toru Komatsu, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Sep. 29, 2021, as Appl. No. 17/488,888.
Application 17/488,888 is a continuation of application No. PCT/JP2020/017144, filed on Apr. 21, 2020.
Claims priority of application No. 2019-086250 (JP), filed on Apr. 26, 2019.
Prior Publication US 2022/0020697 A1, Jan. 20, 2022
Int. Cl. H01L 23/544 (2006.01); H01L 21/268 (2006.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); H01L 25/00 (2006.01)
CPC H01L 23/544 (2013.01) [H01L 21/268 (2013.01); H01L 21/565 (2013.01); H01L 23/552 (2013.01); H01L 25/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate having a first main surface;
a component mounted on the first main surface;
a first sealing resin covering the first main surface and the component; and
a shield film covering at least a surface of the first sealing resin that is opposite the first main surface of the substrate, with the shield film including a protective layer exposed to an outside of the module and a conductive layer covered by the protective layer,
wherein a material of the protective layer has a laser absorption coefficient that is higher than a laser absorption coefficient of a material of the surface of the conductive layer,
wherein the module further comprises a marking section that is not covered by the protective layer and from which the conductive layer is visually exposed to the outside of the module,
wherein a transparent layer is disposed in the marking section on a surface of the conductive layer that is visually exposed to the outside of the module, and
wherein at least a portion of the conductive layer that is visually exposed to the outside of the module through the transparent layer comprises a color that is different from a color of the protective layer.