US 12,237,269 B2
Scalable large system based on organic interconnect
Sanjay Dabral, Cupertino, CA (US); and Ravindranath T. Kollipara, Palo Alto, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Mar. 16, 2022, as Appl. No. 17/655,157.
Prior Publication US 2023/0299007 A1, Sep. 21, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5381 (2013.01) [H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 23/5389 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/1703 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30205 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A multi-chip module comprising:
a routing substrate including an upper metal routing layer, an intermediate metal routing layer, and a lower metal routing layer;
a first die mounted on the routing substrate;
a second die mounted on the routing substrate diagonally adjacent to the first die;
a third die mounted on the routing substrate laterally opposite to the first die, wherein a first die edge of the first die faces a third die edge of the third die;
a first die-to-die routing in the routing substrate connecting the first die to the second die, wherein the first die-to die routing spans a first longitudinal distance in one or more metal routing layers of the routing substrate; and
a second die-to-die routing connecting the first die to the third die, wherein the second die-to-die routing spans a second longitudinal distance in a single metal routing layer of the routing substrate that is greater than the first longitudinal distance.