US 12,237,263 B2
Semiconductor apparatus and equipment
Yuichi Kazue, Tokyo (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Apr. 18, 2024, as Appl. No. 18/638,933.
Application 18/638,933 is a continuation of application No. 18/157,916, filed on Jan. 23, 2023, granted, now 11,990,402.
Application 18/157,916 is a continuation of application No. 16/942,944, filed on Jul. 30, 2020, granted, now 11,699,653, issued on Jul. 11, 2023.
Claims priority of application No. 2019-146826 (JP), filed on Aug. 8, 2019.
Prior Publication US 2024/0266281 A1, Aug. 8, 2024
Int. Cl. H01L 23/522 (2006.01); H01L 27/146 (2006.01)
CPC H01L 23/5226 (2013.01) [H01L 27/14627 (2013.01); H01L 27/14636 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor apparatus, comprising:
a first substrate having a photoelectric conversion element;
a second substrate overlapped with the first substrate; and
an electrode portion disposed at a depth between the first substrate and the second substrate,
wherein the first substrate has an opening at a position overlapping the electrode portion,
wherein a through via is disposed to pass through the second substrate, and
wherein in a cross-sectional view, an insulating member extends from one end of a side wall of the opening to another end of the side wall of the opening.