US 12,237,255 B2
Vertical interconnects with variable pitch for scalable escape routing
Mark D. Kellam, Siler City, NC (US); and John Eric Linstadt, Palo Alto, CA (US)
Assigned to Rambus Inc., San Jose, CA (US)
Filed by Rambus Inc., San Jose, CA (US)
Filed on Oct. 12, 2021, as Appl. No. 17/499,712.
Claims priority of provisional application 63/104,332, filed on Oct. 22, 2020.
Prior Publication US 2022/0130745 A1, Apr. 28, 2022
Int. Cl. H01L 23/498 (2006.01)
CPC H01L 23/49838 (2013.01) 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a circuit die; and
an array of circuit die interconnects located on the circuit die, wherein the array of circuit die interconnects comprises:
a first triangular octant of interconnects organized in rows and columns, each column incrementing its number of interconnects from a first side of the first triangular octant to a second side of the first triangular octant, wherein a pitch size between the columns increases in a first repeating pattern from the first side to the second side; and
a second triangular octant of interconnects organized in rows and columns, wherein the second triangular octant is a mirrored copy of the first triangular octant about an axis at the second side of the first triangular octant.